Heat sink on electronic chip

What is a heat sink? A heat sink is a thermal management device, typically made of metal such as aluminum or copper, designed to absorb and dissipate heat from electronic components—most commonly computer chips like CPUs or GPUs. It sits directly on top of the chip, drawing heat away from the surface and allowing it to disperse through an array of fins, which increase the surface area for more efficient cooling.

By itself, a heat sink is a passive cooling device, meaning it has no moving parts and relies on natural convection—where heat rises and escapes into the surrounding air. However, passive cooling alone is often insufficient for high-performance components that generate large amounts of heat. Therefore, heat sinks are frequently combined with active cooling systems, such as fans that force air over the fins to enhance heat dissipation or liquid cooling systems that circulate coolant through pipes to carry heat away from the chip.

Efficient heat sink design is critical to maintaining system stability and performance, preventing overheating, and prolonging the lifespan of electronic devices. Heat sinks are used not only in computers, but also in power electronics, LEDs, and other systems where thermal regulation is essential.

In this project, a chip was installed on top of an electronic board. The chip, constructed from aluminum, is mounted on a copper base to enhance thermal conductivity. Air flows over the setup at a velocity of 1 m/s, promoting convective heat transfer.